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Zettaone Technologies in the realm of engineering and package design. Some of the highlights are

Proficient Engineering Team:

Zettaone Technologies has a skilled engineering team capable of effectively handling interactions with both customers and suppliers.

Global Supplier Engagement:

The company has experience working with different suppliers globally, indicating a broad network and a global perspective in its operations.

Water Level to Swan and Un-swan Process Understanding:

Zettaone Technologies possesses expertise in understanding and working with processes ranging from wafer level to Swan and Un-swan, showcasing a comprehensive understanding of semiconductor manufacturing.

Wire Bond ASIC's, Die, and Flip Chips Expertise:

The engineering team is experienced in dealing with multiple wire bond ASICs, die, and flip chips within a single package.

Complex Structures Handling:

The team can manage complex structures such as stacked die and staggered wire bond placements, showcasing a high level of technical proficiency.

Process Drawing Creation:

Zettaone Technologies is involved in the creation of process drawings, an essential aspect of the engineering and manufacturing process.

Feasibility Studies for Supplier Capability:

The company is capable of delivering feasibility studies promptly, contributing to the efficiency of the overall project cycle time and considering supplier capabilities.

Electromechanical Requirements:

The team is equipped to address electromechanical requirements, emphasizing a holistic approach to package design.

Experience with Leading Manufacturers:

Zettaone Technologies has worked with advanced and leading manufacturers, positioning itself as a single-point solution for package design requirements.

This information collectively underscores the company's technical prowess, global engagement, and commitment to providing end-to-end solutions in the field of package design. The ability to work with various technologies, complex structures, and global suppliers positions Zettaone as a valuable partner in the semiconductor industry.

IC Package Design

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IC Package Design