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Simulation Supports

  • Feasibility Study
  • Stack up Design
  • Conn/Cable Selection
  • Root Cause Analysis on Existing Design
  • Pre/Post Layout Simulations
  • Topology Exploration for Parallel Interfaces
  • Frequency and Time Domain Analysis
  • TDR Analysis and IBIS/AMI Simulation
  • Multi-Board Simulations
  • Model Extraction, S-parameter & RLC Parasitic Extraction
  • BER, ISI, Jitter, Loss(IL,RL) Analysis, Bath-tub Plots,.
  • High Speed Serial / Parallel Interface Analysis
  • Trace, Via, Connector, End-to-End Channel Modeling Using EM Solver
  • Crosstalk & S-parameter Modeling of Traces & Interconnects

SI/PI/Thermal Analysis

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  3. SI/PI/Thermal Analysis
SI/PI/Thermal Analysis
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Signal Integrity

Zettaone supports advanced analysis with extensive experience on Highspeed Interfaces. As clock speeds and data rates are increasing and industry need high-speed interfaces with multi-GHz frequencies, Signal Integrity (SI) and Power Integrity (PI) Analysis are key factor achieving a PCB or system level performances.

Simulations are performed with leading-edge SI software to ensure the board performance meets as expected. Multiple tools are used to perform a wide range of analysis tasks including 3D EM full-wave extraction, network analysis, channel analysis, AC power analysis and DC power analysis.