PCBA

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PCBA
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Zettaone Technologies has significant strengths in manufacturing, particularly in the areas of prototype and medium volume production.

  • We support, rapid prototyping, Low, Mid volumes - High Mix, Complex, Advanced technology PCB, PCBA, with No MoQ requirements. 
  • We can meet IPC Class- 2,3 for PCBA and Box build requirements with consistent quality. 
  • We are AS 9100:2016, ISO 9001-2015, IATF 16949:2016 certified company.

End to End-fully Automated - front and back-end line:

We have 15000 sq. feet of state of art manufacturing facility with 2-SMT-125k CPH lines, which can handle high mix, mid volume, complex assemblies.

We support:

  • Our machines can handle 01005, 0201, QFP, QFN BGA CSP's (Upto 0.2mm pitch) and BGA 0.35mm Pitch. We have in-line AOI and Xray machines for PCBA inspection. 
  • SAP / MES system to track all the traceability across the company. 
  • In-Line Clean and No-clean Process. 
  • Flying probe tester for fixture less testing
  • 3 weeks of Turnaround times for the Turnkey projects with 5-day fast turnaround PCBA Assembly
  • Fully automated conformal coating line.
  • Thermal shock and Thermal cycling chambers
  • Functional and EOL testing
  • Box builds.
  • Packaging
  • BGA Rework 
  • RMA support
Skilled manpower:
  • We have IPC 600x, 610x, J-STD, IPC 7711 trained technicians, deployed over at all critical stages of process.
Advance Pre-Engineering:
  • We perform the “build readiness checks” much before the production build and review for any manufacturing challenges.
  • We work on the mitigate with DOE’s / Test vehicle / Fixture development. We perform DFM/DFA Valor analysis for all the high complex builds before taking for production. 
IQA checks:
  • Zettaone has deployed unique process of checking every line item for its “FIT function through DFA checks” of the component on the Physical board much before the build. This eliminates the last moment surprises during the build and can avoid line stops.

Component Engineering:
  • We support life cycle management of BOM using the silicon expert tool. 
  • We support RoHS, Reach, EOL, APN, Industrial parts, risk analysis for the BOM scrubbing process.
Our Quality:
  • We have deployed - FAIR – first article, In process, Final QA and OOB-out of box QA methodology for the Quality assurance of products. 
  • We meet global requirements of the rejections at every critical stage of process with DPMO /FPY measurements.